JPH0250624B2 - - Google Patents
Info
- Publication number
- JPH0250624B2 JPH0250624B2 JP14371582A JP14371582A JPH0250624B2 JP H0250624 B2 JPH0250624 B2 JP H0250624B2 JP 14371582 A JP14371582 A JP 14371582A JP 14371582 A JP14371582 A JP 14371582A JP H0250624 B2 JPH0250624 B2 JP H0250624B2
- Authority
- JP
- Japan
- Prior art keywords
- bed
- resin
- plate
- inner leads
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000008188 pellet Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49558—Insulating layers on lead frames, e.g. bridging members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14371582A JPS5933852A (ja) | 1982-08-19 | 1982-08-19 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14371582A JPS5933852A (ja) | 1982-08-19 | 1982-08-19 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5933852A JPS5933852A (ja) | 1984-02-23 |
| JPH0250624B2 true JPH0250624B2 (en]) | 1990-11-02 |
Family
ID=15345295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14371582A Granted JPS5933852A (ja) | 1982-08-19 | 1982-08-19 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933852A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2503029B2 (ja) * | 1987-10-06 | 1996-06-05 | 沖電気工業株式会社 | 薄型構造の半導体装置の製造方法 |
| JPH0180952U (en]) * | 1987-11-19 | 1989-05-30 | ||
| JP3631770B2 (ja) * | 1993-01-22 | 2005-03-23 | 本田技研工業株式会社 | 内燃機関の吸気装置 |
| JP3494284B2 (ja) | 1999-09-03 | 2004-02-09 | 本田技研工業株式会社 | ４ストロークサイクル内燃機関の吸気ポート構造 |
-
1982
- 1982-08-19 JP JP14371582A patent/JPS5933852A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5933852A (ja) | 1984-02-23 |
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